BGA Reballing Kit is used for reballing the solder balls of a BGA IC (Ball Grid Array). There are several Kits and BGA rework stations available in the market.

Most repairing professionals generally start with a starter Kit and gradually shift to latest universal kits and stations.

Contents of BGA Reballing Kit
ESD-Safe Cleaning Brush.
BGA Reballing Stencil.
BGA Desoldering Wire / Wick / Braid
Solder Paste.
Acetone or IPA Solution.
Soldering Flux.
Heat Resistant Kapton Tape or Clips to hold the BGA IC to the Stencil.
PCB Holder.
Tweezers.
SMD Rework Station and Soldering Iron are generally NOT a part of the Kit.